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TPU Hot Melt Film Bonding Troubleshooter
Awaiting symptom selection to run diagnostics…
Likely causes: activation temperature, pressure, or dwell time mismatch
- Activation temperature too low for the grade — film did not fully melt
- Trapped air or moisture in the substrate escaping during heating
- Pressure applied too briefly for the film thickness in use
Likely causes: substrate mismatch or under-activation
- Wrong chemistry type for the substrate (see the 3-Type Chemistry Selector)
- Activation temperature at the low end of the grade’s range for a demanding substrate
- Contaminated or coated substrate surface preventing full adhesion
Likely causes: temperature far below activation range, or incompatible substrate
- Heat press or oven temperature well below the film’s rated activation range
- Substrate surface treated with a release agent or heavy coating
- Wrong film grade entirely for this substrate class
Likely causes: excess heat or extended dwell time
- Activation temperature set above the grade’s rated range
- Dwell time longer than needed, causing thermal degradation
- Grade selected does not match the flame-retardant or UV-stability requirement of the application
Likely causes: wrong chemistry for flexibility needs, or over-activation
- Polyester-type grade used where polyether or polycaprolactone flexibility was needed
- Excess bonding pressure compressing the film beyond its rated thickness
- Wrong thickness grade for the stretch requirement of the fabric
